Uniformity of an electroless plated Ni on a pad connected to different size pads or a Pn junction for under bump metallurgy in a flip-chip assembly
- Akihiro Ikeda
- , Tsubasa Saeki
- , Atsushi Sakamoto
- , Yosuke Sugimoto
- , Yasuhiro Kimiya
- , Fukunaga Fukunaga
- , Reiji Hattori
- , Hisao Kuriyaki
- , Yukinori Kuroki
研究成果: ジャーナルへの寄稿 › 学術誌 › 査読
6
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(Scopus)