Temperature measurement by using metal thin film themocouples

Koji Miyazaki, Takahiro Miike, Hiroshi Tsukamoto, Toshiaki Takamiya

研究成果: 書籍/レポート タイプへの寄稿会議への寄与

3 被引用数 (Scopus)

抄録

We fabricate metal thin film thermocouples (TFTCs). Au-Pt, Cu-Ni, and W-Ni are deposited on a glass plate using standard thin film processes. The dimension of thermocouple junction is 300μm × 300μm. The thermoelectric powers of TFTCs are different from those of bulk because diffusion of electrons is restricted by the very thin film. The film thickness of TFTCs is of the same order as the mean free path of electrons. However TFTCs are still useful for temperature measurements because the thermoelectric voltage is proportional to measured temperature at thermocouple junction. The response time of Au-Pt TFTCs is about 30ns when the surface of the glass is heated by a YAG pulsed laser. The result compares favorably with measurements by a thermoreflectance method We also describe W-Ni nano-TFTCs fabricated by Focused Ion Beam for the measurement of temperature distribution in a sub-micron area. In order to reduce the size of the TFTCs we employ a 3-dimensional structure.

本文言語英語
ホスト出版物のタイトルAdvances in Electronic Packaging 2003
ホスト出版物のサブタイトルVolume 1
ページ219-223
ページ数5
出版ステータス出版済み - 2003
外部発表はい
イベント2003 International Electronic Packaging Technical Conference and Exhibition - Haui, HI, 米国
継続期間: 7月 6 20037月 11 2003

出版物シリーズ

名前Advances in Electronic Packaging
1

会議

会議2003 International Electronic Packaging Technical Conference and Exhibition
国/地域米国
CityHaui, HI
Period7/6/037/11/03

!!!All Science Journal Classification (ASJC) codes

  • 工学一般
  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料

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