抄録
A highly adherent Cu-Ni-P film was successfully grown on a UV-irradiated liquid-crystal-polymer (LCP) film. Irradiation from a UV light under an atmospheric condition created hydrophilic nanometer-scale roughness on the LCP film surface by introducing hydrophilic groups on the surface. The high adhesion strength of more than 0.8 kN/m was obtained because of the anchoring effect of the nanometer-scale roughness developed at the interface between the deposited metal and the LCP film. Copper circuit patterns formed on the LCP film showed satisfactory performance for various reliability tests. Fine circuit formation and selective plating facilitated by UV irradiation could lead to a manufacturing approach for the next generation of flexible-printed-circuit technology.
本文言語 | 英語 |
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ページ(範囲) | D360-D363 |
ジャーナル | Journal of the Electrochemical Society |
巻 | 156 |
号 | 9 |
DOI | |
出版ステータス | 出版済み - 2009 |
外部発表 | はい |
!!!All Science Journal Classification (ASJC) codes
- 電子材料、光学材料、および磁性材料
- 再生可能エネルギー、持続可能性、環境
- 表面、皮膜および薄膜
- 電気化学
- 材料化学