TY - JOUR
T1 - Structural characterization of silicon carbide etched by using a combination of ion implantation and wet chemical etching
AU - Henkel, T.
AU - Ferro, G.
AU - Nishizawa, S.
AU - Pressler, H.
AU - Tanaka, Y.
AU - Tanoue, H.
AU - Kobayashi, N.
N1 - Copyright:
Copyright 2005 Elsevier Science B.V., Amsterdam. All rights reserved.
PY - 2000
Y1 - 2000
N2 - Silicon carbide has been etched using a combination of high-dose ion implantation and wet chemical etching. Structural properties with respect to the remaining damage after etching have been studied using atomic force microscopy, Rutherford backscattering/channeling, and Raman spectroscopy. No significant deterioration of the crystal quality has been found after the etching process. Moreover, the as-etched surface is characterized by a lower roughness compared to virgin material. The results demonstrate that this etching method can be used for the fabrication of contacts on silicon carbide surfaces.
AB - Silicon carbide has been etched using a combination of high-dose ion implantation and wet chemical etching. Structural properties with respect to the remaining damage after etching have been studied using atomic force microscopy, Rutherford backscattering/channeling, and Raman spectroscopy. No significant deterioration of the crystal quality has been found after the etching process. Moreover, the as-etched surface is characterized by a lower roughness compared to virgin material. The results demonstrate that this etching method can be used for the fabrication of contacts on silicon carbide surfaces.
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M3 - Conference article
AN - SCOPUS:0033687497
SN - 0255-5476
VL - 338
SP - I/-
JO - Materials Science Forum
JF - Materials Science Forum
T2 - ICSCRM '99: The International Conference on Silicon Carbide and Related Materials
Y2 - 10 October 1999 through 15 October 1999
ER -