Soft Enveloping Gripper Driving Several Fingers by 3D Snap Through Buckling Mechanism

Hiroki Hanamori, Akihiro Kawamura, Ryo Kurazume

研究成果: 書籍/レポート タイプへの寄稿会議への寄与

抄録

It is difficult to automate the grasping of delicate fruits such as peaches, which require sensitive work. Envelope grasping is an effective approach for grasping such objects due to its large contact area with the object. A method to realize envelope grasping is the fingered gripper, which can perform grasping that follows the shape of the object through compliant interaction. However, this method has the problem that it is structurally difficult to fill the space between fingers. Another method of achieving enveloping grasp is to envelop the object by membrane. This method can touch the object without gap between fingers, but it is difficult to grasp unexpectedly large objects because it cannot deform as large as a fingered gripper. In this study, we propose a soft gripper that realizes envelope grasping while largely deforming several fingers. The proposed method opens and closes using the turning over of the hemispherical shell due to the 3D snap through buckling mechanism. By employing this mechanism, allowing all objects touching the edge of the hemispherical shell to be moved simultaneously and significantly, fingers arranged without gaps can be deformed largely. Another advantage is that it requires no energy to maintain the grasping state due to its bistable, snap through buckling characteristics. In this paper, we present a design methodology based on specific examples and an evaluation of performance.

本文言語英語
ホスト出版物のタイトルIECON 2023 - 49th Annual Conference of the IEEE Industrial Electronics Society
出版社IEEE Computer Society
ISBN(電子版)9798350331820
DOI
出版ステータス出版済み - 10月 2023
イベント49th Annual Conference of the IEEE Industrial Electronics Society, IECON 2023 - Singapore, シンガポール
継続期間: 10月 16 202310月 19 2023

出版物シリーズ

名前IECON Proceedings (Industrial Electronics Conference)
ISSN(印刷版)2162-4704
ISSN(電子版)2577-1647

会議

会議49th Annual Conference of the IEEE Industrial Electronics Society, IECON 2023
国/地域シンガポール
CitySingapore
Period10/16/2310/19/23

!!!All Science Journal Classification (ASJC) codes

  • 制御およびシステム工学
  • 電子工学および電気工学

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