TY - GEN
T1 - Room-temperature chip-stack interconnection using compliant bumps and wedge-incorporated electrodes
AU - Watanabe, Naoya
AU - Asano, Tanemasa
PY - 2010
Y1 - 2010
N2 - We propose room-temperature chip-stack interconnection using mechanical caulking between compliant bumps and wedge-incorporated electrodes. In this method, cone-shaped compliant bumps made of Au are pressed into wedgeincorporated electrodes made of Au at room temperature in the ambient air. Because of the edge structures of the Au wedge incorporated electrodes, the pressing load is effectively applied to the interfaces between Au cone bumps and Au wedge-incorporated electrodes. Therefore, Au wedgeincorporated electrodes are caulked with Au cone bumps at low pressing load. By using this method, high-density interchip connections were realized at 0.50 gf/bump and 30 °C. The number of inter-chip connections realized was 30,600 with 20 μm pitch. It is also demonstrated that this method allows lower inter-chip connection resistance than the mechanical caulking between compliant bumps and doughnut-shaped electrodes
AB - We propose room-temperature chip-stack interconnection using mechanical caulking between compliant bumps and wedge-incorporated electrodes. In this method, cone-shaped compliant bumps made of Au are pressed into wedgeincorporated electrodes made of Au at room temperature in the ambient air. Because of the edge structures of the Au wedge incorporated electrodes, the pressing load is effectively applied to the interfaces between Au cone bumps and Au wedge-incorporated electrodes. Therefore, Au wedgeincorporated electrodes are caulked with Au cone bumps at low pressing load. By using this method, high-density interchip connections were realized at 0.50 gf/bump and 30 °C. The number of inter-chip connections realized was 30,600 with 20 μm pitch. It is also demonstrated that this method allows lower inter-chip connection resistance than the mechanical caulking between compliant bumps and doughnut-shaped electrodes
UR - https://www.scopus.com/pages/publications/77955190388
UR - https://www.scopus.com/pages/publications/77955190388#tab=citedBy
U2 - 10.1109/ECTC.2010.5490730
DO - 10.1109/ECTC.2010.5490730
M3 - Conference contribution
AN - SCOPUS:77955190388
SN - 9781424464104
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1763
EP - 1768
BT - 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010
T2 - 60th Electronic Components and Technology Conference, ECTC 2010
Y2 - 1 June 2010 through 4 June 2010
ER -