TY - GEN
T1 - Red Microfluidic Electrogenerated Chemiluminescence Device Using Tetraphenyldibenzoperiflanthene as a Guest Molecule
AU - Yamamoto, Seiya
AU - Ishimatsu, Ryoichi
AU - Okada, Koji
AU - Kato, Emiri
AU - Mizuno, Jun
AU - Kasahara, Takashi
N1 - Funding Information:
This research was supported by JSPS KAKENHI Grant Number JP21K14170.
Publisher Copyright:
© 2022 Japan Institute of Electronics Packaging.
PY - 2022
Y1 - 2022
N2 - We evaluated the performance of a red microfluidic electrogenerated chemiluminescence (ECL) device using tetraphenyldibenzoperiflanthene (DBP) as a fluorescent guest. 5,6,11,12-Tetraphenylnaphthacene (rubrene), which is a well-known yellow fluorescent material, was used as a host molecule and dissolved in an organic solvent with the guest. The microfluidic ECL device with the DBP-doped rubrene solution exhibited a bright red emission originated from DBP with a maximum luminance of 62.0 cd/m2 at a direct current voltage of 5.5 V. By contrast, when the rubrene host was absent from the solution, the ECL emission of DBP was found to be significantly weak. Electrochemical properties of rubrene and DBP were also evaluated by cyclic voltammetry to discuss the emission mechanism.
AB - We evaluated the performance of a red microfluidic electrogenerated chemiluminescence (ECL) device using tetraphenyldibenzoperiflanthene (DBP) as a fluorescent guest. 5,6,11,12-Tetraphenylnaphthacene (rubrene), which is a well-known yellow fluorescent material, was used as a host molecule and dissolved in an organic solvent with the guest. The microfluidic ECL device with the DBP-doped rubrene solution exhibited a bright red emission originated from DBP with a maximum luminance of 62.0 cd/m2 at a direct current voltage of 5.5 V. By contrast, when the rubrene host was absent from the solution, the ECL emission of DBP was found to be significantly weak. Electrochemical properties of rubrene and DBP were also evaluated by cyclic voltammetry to discuss the emission mechanism.
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U2 - 10.23919/ICEP55381.2022.9795613
DO - 10.23919/ICEP55381.2022.9795613
M3 - Conference contribution
AN - SCOPUS:85133390973
T3 - 2022 International Conference on Electronics Packaging, ICEP 2022
SP - 23
EP - 24
BT - 2022 International Conference on Electronics Packaging, ICEP 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Electronics Packaging, ICEP 2022
Y2 - 11 May 2022 through 14 May 2022
ER -