@inproceedings{2c7c53c38fa44590a6337c0d546e3343,
title = "On-Chip 300-GHz-Band Power Combining with Arrayed InGaAs UTC-PDs and Corporate-Fed 2{\texttimes}2 MPA on SiC Substrate for Wireless Communication",
abstract = "This work presents the on-chip integration of a 2{\texttimes}2 microstrip patch antennas (MPAs) with four InGaAs uni-traveling-carrier photodiodes (UTC-PDs) on a silicon carbide (SiC) substrate for advancing THz wireless communications. The results demonstrate that the high thermal conductivity of the SiC substrate increases the output power of each UTC-PD to the milliwatt level. Furthermore, power combining of mulitple UTC-PDs through a microstrip-based Tee network in the 300-GHz band achieves an absolute power enhancement, while lens-free beam combining via the planar MPA array further enhances spatial power efficiency.",
keywords = "Antenna Array, Power Combining, SiC, Terahertz, UTC-PD",
author = "Ming Che and Yoshiki Kamiura and Ryo Doi and Hussein Ssali and Hiroki Agemori and Bo Li and Kazutoshi Kato",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 2024 IEEE Asia-Pacific Microwave Conference, APMC 2024 ; Conference date: 17-11-2024 Through 20-11-2024",
year = "2024",
doi = "10.1109/APMC60911.2024.10867735",
language = "English",
series = "Asia-Pacific Microwave Conference Proceedings, APMC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "4--6",
booktitle = "2024 Asia-Pacific Microwave Conference",
address = "United States",
}