TY - GEN
T1 - Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface
AU - Tsukamoto, Hideaki
AU - Dong, Zigang
AU - Huang, Han
AU - Nishimura, Tetsuro
AU - Nogita, Kazuhiro
PY - 2010
Y1 - 2010
N2 - The intermetallics of Cu6Sn5 that are formed at the Sn-based solder/Cu substrate interface play a significant role in solder joint reliability. The characterization of the mechanical properties of the interface Cu6Sn5 is essential to understand the mechanical performance and structural integrity of the solder joints. In this study, the interface Cu6Sn5 and (Cu,Ni)6Sn5 formed in Sn-Cu and Sn-Cu-Ni ball grid array (BGA) joints were investigated using nanoindentation. The results demonstrated that the strain rate sensitivity and the activation volume of these intermetallics were affected by the reflow times and load conditions. The strain rate sensitivity of Cu6Sn 5 and (Cu,Ni)6Sn5 were estimated from 0.023 to 0.105, and the activation volume of Cu6Sn5 and (Cu,Ni)6Sn5 were estimated from 0.128 b3 to 0.624 b3 (b=4.2062×10-9 m) for 1, 2 and 4-reflowed Sn-Cu (-Ni) samples.
AB - The intermetallics of Cu6Sn5 that are formed at the Sn-based solder/Cu substrate interface play a significant role in solder joint reliability. The characterization of the mechanical properties of the interface Cu6Sn5 is essential to understand the mechanical performance and structural integrity of the solder joints. In this study, the interface Cu6Sn5 and (Cu,Ni)6Sn5 formed in Sn-Cu and Sn-Cu-Ni ball grid array (BGA) joints were investigated using nanoindentation. The results demonstrated that the strain rate sensitivity and the activation volume of these intermetallics were affected by the reflow times and load conditions. The strain rate sensitivity of Cu6Sn 5 and (Cu,Ni)6Sn5 were estimated from 0.023 to 0.105, and the activation volume of Cu6Sn5 and (Cu,Ni)6Sn5 were estimated from 0.128 b3 to 0.624 b3 (b=4.2062×10-9 m) for 1, 2 and 4-reflowed Sn-Cu (-Ni) samples.
KW - Activation volume
KW - Indentation creep
KW - Intermetallics
KW - Lead-free solder
KW - Nanoindentation
KW - Strain rate sensitivity
UR - https://www.scopus.com/pages/publications/77955476104
UR - https://www.scopus.com/pages/publications/77955476104#tab=citedBy
U2 - 10.4028/www.scientific.net/MSF.654-656.2446
DO - 10.4028/www.scientific.net/MSF.654-656.2446
M3 - Conference contribution
AN - SCOPUS:77955476104
SN - 0878492550
SN - 9780878492558
T3 - Materials Science Forum
SP - 2446
EP - 2449
BT - PRICM7
PB - Trans Tech Publications Ltd
T2 - 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7
Y2 - 2 August 2010 through 6 August 2010
ER -