Microstructure and texture of electroformed copper liners of shaped charges

Wenhuai Tian, Hongye Gao, Ailing Fan, Xiaoou Shan, Qi Sun

研究成果: ジャーナルへの寄稿学術誌査読

9 被引用数 (Scopus)

抄録

The microstructures of copper linear of shaped charyes prepared by electroforming technique were investigated by transmission electron microscopy (TEM). Meanwhile, the orientations distributing of the grains in the electroformed copper liners of shaped charges was examined by the electron backscattering Kikuchi pattern (EBSP) technique. TEM observations have revealed that these electroformed copper liners of shaped charges have the grain size of about 1-3 μ and the grains have a preferential orientation distribution along the growth direction. EBSP analysis has demonstrated that the as-formed copper liners of shaped charges exhibit a micro-texture, i.e. one type of fiber texture, and the preferred growth direction is normal to the surface of the liners.

本文言語英語
ページ(範囲)265-268
ページ数4
ジャーナルJournal of University of Science and Technology Beijing: Mineral Metallurgy Materials (Eng Ed)
9
4
出版ステータス出版済み - 8月 2002
外部発表はい

!!!All Science Journal Classification (ASJC) codes

  • 材料科学一般
  • 地盤工学および土木地質学
  • 材料力学
  • 機械工学
  • 物理化学および理論化学
  • 金属および合金
  • 材料化学

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