TY - GEN
T1 - Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder
AU - Kawamoto, N.
AU - Murakami, Y.
AU - Shindo, D.
AU - Suganuma, K.
PY - 2007/12/1
Y1 - 2007/12/1
N2 - Microstructure of Ag-epoxy conductive adhesive, which is expected as a substitution for Pb-free solder, has been investigated by electron microscopy. The observations have demonstrated the presence of agglomerations of Ag particles, and they are likely to be connected to form huge conduction paths in a solidified state. Moreover, multidisciplinary tests (e.g., simultaneous examination of the microstructure and electric resistivity) on the solidified adhesives were performed inside the transmission electron microscope with the aid of mobile microprobes.
AB - Microstructure of Ag-epoxy conductive adhesive, which is expected as a substitution for Pb-free solder, has been investigated by electron microscopy. The observations have demonstrated the presence of agglomerations of Ag particles, and they are likely to be connected to form huge conduction paths in a solidified state. Moreover, multidisciplinary tests (e.g., simultaneous examination of the microstructure and electric resistivity) on the solidified adhesives were performed inside the transmission electron microscope with the aid of mobile microprobes.
UR - http://www.scopus.com/inward/record.url?scp=49949103996&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=49949103996&partnerID=8YFLogxK
U2 - 10.1109/POLYTR.2007.4339147
DO - 10.1109/POLYTR.2007.4339147
M3 - Conference contribution
AN - SCOPUS:49949103996
SN - 1424411866
SN - 9781424411863
T3 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings
SP - 101
EP - 104
BT - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings
T2 - Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
Y2 - 15 January 2007 through 18 January 2007
ER -