TY - GEN

T1 - Method of analysis for two-dimensional stationary thermoelastic problems by body force method

AU - Nisitani, Hironobu

AU - Saimoto, Akihide

AU - Noguchi, Hiroshi

AU - Chen, Dai Heng

PY - 1992

Y1 - 1992

N2 - In this paper, the method for analyzing two-dimensional stationary thermoelastic problems is developed based on the body force method (BFM). The BFM is a kind of boundary type method and the principle of superposition is the base of this method. That is, in the BFM, the required elastic field is expressed by means of superposing the elastic fields of fundamental solution. In the analysis of thermoelastic problems, the temperature field and the elastic field due to an isolated heat source acting in an infinite plate is used as the fundamental thermoelastic solution. Namely, isolated heat sources are continuously distributed along an imaginary boundary so that the given temperature conditions are satisfied. To show the effectiveness of this method, the thermoelastic problems were solved analytically for the case of uniform heat flow disturbed by a thermally insulated hole or crack. Some numerical results were also shown in the forms of tables and graphs.

AB - In this paper, the method for analyzing two-dimensional stationary thermoelastic problems is developed based on the body force method (BFM). The BFM is a kind of boundary type method and the principle of superposition is the base of this method. That is, in the BFM, the required elastic field is expressed by means of superposing the elastic fields of fundamental solution. In the analysis of thermoelastic problems, the temperature field and the elastic field due to an isolated heat source acting in an infinite plate is used as the fundamental thermoelastic solution. Namely, isolated heat sources are continuously distributed along an imaginary boundary so that the given temperature conditions are satisfied. To show the effectiveness of this method, the thermoelastic problems were solved analytically for the case of uniform heat flow disturbed by a thermally insulated hole or crack. Some numerical results were also shown in the forms of tables and graphs.

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M3 - Conference contribution

AN - SCOPUS:0027101599

SN - 0791807665

T3 - American Society of Mechanical Engineers, EEP

SP - 437

EP - 446

BT - American Society of Mechanical Engineers, EEP

PB - Publ by ASME

T2 - Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)

Y2 - 9 April 1992 through 12 April 1992

ER -