TY - GEN
T1 - Low-temperature bonding of optical chips using coined Au stud bumps and its application to micro laser Doppler velocimeter
AU - Yamamoto, Michitaka
AU - Sato, Takeshi
AU - Higurashi, Eiji
AU - Suga, Tadatomo
AU - Sawada, Renshi
PY - 2012
Y1 - 2012
N2 - Surface activated bonding of laser diode (LD) chips on coined Au stud bumps (thickness: 10∼15 μm) with smooth surfaces (R a < 3.5 nm) was demonstrated for optical microsensor applications. Bonding of LD chips with Au thin films to the Au stud bumps on the Si substrates was performed in ambient air at low temperature (150 °C). Die-shear strength per unit area was three times as high as that obtained between Au thin films (thickness: 0.5 μm). Using this technique, compact and thin micro laser Doppler velocimeter (2.8 mm ×2.8 mm ×1 mm thick) was developed. The feasibility of measuring velocity was demonstrated for a moving Au wire (diameter: 22 μm).
AB - Surface activated bonding of laser diode (LD) chips on coined Au stud bumps (thickness: 10∼15 μm) with smooth surfaces (R a < 3.5 nm) was demonstrated for optical microsensor applications. Bonding of LD chips with Au thin films to the Au stud bumps on the Si substrates was performed in ambient air at low temperature (150 °C). Die-shear strength per unit area was three times as high as that obtained between Au thin films (thickness: 0.5 μm). Using this technique, compact and thin micro laser Doppler velocimeter (2.8 mm ×2.8 mm ×1 mm thick) was developed. The feasibility of measuring velocity was demonstrated for a moving Au wire (diameter: 22 μm).
UR - https://www.scopus.com/pages/publications/84864845952
UR - https://www.scopus.com/pages/publications/84864845952#tab=citedBy
U2 - 10.1109/LTB-3D.2012.6238061
DO - 10.1109/LTB-3D.2012.6238061
M3 - Conference contribution
AN - SCOPUS:84864845952
SN - 9781467307420
T3 - Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
SP - 99
BT - Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
T2 - 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Y2 - 22 May 2012 through 23 May 2012
ER -