Low temperature (210 °C) fabrication of Ge MOS capacitor and controllability of its flatband voltage

Germanium (Ge) and germanium tin (GeSn) are strong candidate materials for novel electronic device such as spin MOS field-effect transistor (FET) or flexible devices. A high-quality insulating layer on Ge(Sn) should be formed at low temperatures to realize these applications. In this study, we fabricated a Ge MOS capacitor (CAP) and n-MOSFET with a SiO₂/GeO₂ gate dielectric using an electron cyclotron resonance plasma process and subsequent post-deposition annealing at a low temperature of 210 °C. The MOSCAPs show the typical electrical characteristics without significant degradation compared with the samples fabricated at a higher temperature of 450 °C. The n-MOSFET shows distinct output characteristics with clear saturation behavior and high current drivability. From the flatband voltage comparison among different annealing temperatures, high-temperature annealing induces the interface dipole formation in the gate insulator, significantly shifting flatband voltage to a negative direction. X-ray photoelectron spectroscopy analysis suggests that the origin of the interface dipole is oxygen atom movement at a SiO₂/GeO₂ interface. This information will be an important guideline for fabricating a high-quality insulator on Ge(Sn) at low temperatures.