@inproceedings{1550f4c767a24c9a8599e769d3bf834d,
title = "Lithium niobate-on-insulator waveguide on Si substrate fabricated by room temperature bonding",
abstract = "We have developed low-temperature bonding and surface micromachining techniques for realizing high quality lithium niobate-on-insulator (LNOI) waveguide device integrated on mature Si platform. This paper reports a fabrication of LNOI ridge waveguides on Si substrates using room-temperature bonding with Si nanoadhesive layer and ultra-precision ductile-mode cutting.",
author = "R. Takigawa and K. Kamimura and K. Nakamoto and T. Asano",
year = "2019",
month = may,
doi = "10.23919/LTB-3D.2019.8735194",
language = "English",
series = "Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019",
address = "United States",
note = "6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 ; Conference date: 21-05-2019 Through 25-05-2019",
}