Influence of high-temperature solution treatments on mechanical properties of an Al-Si-Cu aluminum alloy

Hiroyuki Toda, Takanori Nishimura, Kentaro Uesugi, Yoshio Suzuki, Masakazu Kobayashi

研究成果: ジャーナルへの寄稿学術誌査読

72 被引用数 (Scopus)

抄録

It has been demonstrated that the strength of an Al-Si-Cu alloy is maximized by high-temperature solution treatment at 807 K, which is approximately 16 K higher than the ternary eutectic temperature. The dual-energy K-edge subtraction imaging technique has been employed to obtain the spatial distribution of copper and its change during its solution treatment in three dimensions quantitatively, providing interpretations of the improved mechanical properties in terms of age-hardenability and its spatial variation. It has been also confirmed that the occurrence of incipient local melting and the accompanying growth of micro pores adjacent to the melt regions lead to fractures caused by these defects. However, it can be inferred that the positive effects can outweigh the negative effects even above the eutectic temperature, thereby realizing the maximum strength at such relative high temperature levels.

本文言語英語
ページ(範囲)2014-2025
ページ数12
ジャーナルActa Materialia
58
6
DOI
出版ステータス出版済み - 4月 2010
外部発表はい

!!!All Science Journal Classification (ASJC) codes

  • 電子材料、光学材料、および磁性材料
  • セラミックおよび複合材料
  • ポリマーおよびプラスチック
  • 金属および合金

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