抄録
In-situ observations of the polymorphic transformation in a single targeted Cu6Sn5 grain constrained between Sn-0.7wt%Cu solder and Cu-Cu3Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (HV-TEM) technique. Here, we show that themonoclinic η'-Cu6Sn5 superlattice reflections appear in the hexagonal η-Cu6Sn5 diffraction pattern upon cooling to isothermal 140 °C from 210 °C. The in-situ real space imaging shows that the η'-Cu6Sn5 contrast pattern is initiated at the grain boundary. This method demonstrates a new approach for further understanding the polymorphic transformation behavior on a real solder joint.
本文言語 | 英語 |
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論文番号 | 2229 |
ジャーナル | Materials |
巻 | 11 |
号 | 11 |
DOI | |
出版ステータス | 出版済み - 11月 9 2018 |
!!!All Science Journal Classification (ASJC) codes
- 材料科学一般