Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint

Flora Somidin, Hiroshi Maeno, Xuan Quy Tran, Stuart D. McDonald, Mohd Arif Anuar Mohd Salleh, Syo Matsumura, Kazuhiro Nogita

研究成果: ジャーナルへの寄稿学術誌査読

15 被引用数 (Scopus)

抄録

In-situ observations of the polymorphic transformation in a single targeted Cu6Sn5 grain constrained between Sn-0.7wt%Cu solder and Cu-Cu3Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (HV-TEM) technique. Here, we show that themonoclinic η'-Cu6Sn5 superlattice reflections appear in the hexagonal η-Cu6Sn5 diffraction pattern upon cooling to isothermal 140 °C from 210 °C. The in-situ real space imaging shows that the η'-Cu6Sn5 contrast pattern is initiated at the grain boundary. This method demonstrates a new approach for further understanding the polymorphic transformation behavior on a real solder joint.

本文言語英語
論文番号2229
ジャーナルMaterials
11
11
DOI
出版ステータス出版済み - 11月 9 2018

!!!All Science Journal Classification (ASJC) codes

  • 材料科学一般

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