Hybrid integration of LiNbO 3 thin films on micromachined Si substrates using room-temperature transfer bonding

R. Takigawa; E. Higurashi; T. Suga; T. Kawanishi

doi:10.1109/LTB-3D.2012.6238064

Hybrid integration of LiNbO ₃ thin films on micromachined Si substrates using room-temperature transfer bonding

R. Takigawa
, E. Higurashi
, T. Suga
, T. Kawanishi

研究成果: 書籍/レポートタイプへの寄稿 › 会議への寄与

1 被引用数 (Scopus)

抄録

Hybrid integration of high-quality lithium niobate (LiNbO ₃) single-crystal thin films (<5 μm) on micromachined Si substrates has been demonstrated using room-temperature flip-chip transfer bonding based on surface-activated bonding with Au microbumps.

本文言語	英語
ホスト出版物のタイトル	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
ページ	105
ページ数	1
DOI	https://doi.org/10.1109/LTB-3D.2012.6238064
出版ステータス	出版済み - 2012
外部発表	はい
イベント	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, 日本継続期間: 5月 22 2012 → 5月 23 2012

出版物シリーズ

名前	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

その他

その他	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
国/地域	日本
City	Tokyo
Period	5/22/12 → 5/23/12

!!!All Science Journal Classification (ASJC) codes

コンピュータグラフィックスおよびコンピュータ支援設計
コンピュータビジョンおよびパターン認識

文献へのアクセス

10.1109/LTB-3D.2012.6238064

他のファイルとリンク

引用スタイル

Takigawa, R., Higurashi, E., Suga, T., & Kawanishi, T. (2012). Hybrid integration of LiNbO ₃ thin films on micromachined Si substrates using room-temperature transfer bonding. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 (pp. 105). 記事 6238064 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). https://doi.org/10.1109/LTB-3D.2012.6238064

Hybrid integration of LiNbO ₃ thin films on micromachined Si substrates using room-temperature transfer bonding. / Takigawa, R.; Higurashi, E.; Suga, T. その他.
Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 105 6238064 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

研究成果: 書籍/レポートタイプへの寄稿 › 会議への寄与

Takigawa, R, Higurashi, E, Suga, T & Kawanishi, T 2012, Hybrid integration of LiNbO ₃ thin films on micromachined Si substrates using room-temperature transfer bonding. in Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012., 6238064, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, pp. 105, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, Tokyo, 日本, 5/22/12. https://doi.org/10.1109/LTB-3D.2012.6238064

Takigawa R, Higurashi E, Suga T, Kawanishi T. Hybrid integration of LiNbO ₃ thin films on micromachined Si substrates using room-temperature transfer bonding. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 105. 6238064. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). doi: 10.1109/LTB-3D.2012.6238064

Takigawa, R. ; Higurashi, E. ; Suga, T. その他. / Hybrid integration of LiNbO ₃ thin films on micromachined Si substrates using room-temperature transfer bonding. Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. pp. 105 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

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abstract = "Hybrid integration of high-quality lithium niobate (LiNbO 3) single-crystal thin films (<5 μm) on micromachined Si substrates has been demonstrated using room-temperature flip-chip transfer bonding based on surface-activated bonding with Au microbumps.",

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