Zinc sulfide (ZnS) and its related materials are important materials for UV light emitting diodes, flat panel displays, and IR windows. To utilize these optoelectronic devices for electronic products, it is necessary to make electric circuits or signal lines on the ZnS substrate. However, the films made by conventional processes have weak adhesive strength. To overcome this limitation, we developed an electroless deposition process to make nickel-phosphorus (Ni-P) film. The films made using our process showed high adhesive strength in tensile tests and were also of very uniform thickness.
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