抄録
Fast recovery characteristics can be obtained in the SiGe/Si/Si pin diodes compared to the conventional Si pin diodes without any intentional lifetime controls into the i-layer. This technique also makes little change in the on-state voltage drop (Vf), which suggests the low power dissipation with the fast operation in the switching circuits. It is highly possible that the thin SiGe p layer with the suppressed minority carrier lifetime enhances the diffusion current in the SiGe pin diode, where the stored minority carrier effectively decreases in the Si i-layer. It is also possible that the recombination of minority carrier at the interface of the SiGe and the metal layers increases the diffusion current in the pin diode.
| 本文言語 | 英語 |
|---|---|
| ページ | 1015-1020 |
| ページ数 | 6 |
| 出版ステータス | 出版済み - 2004 |
| 外部発表 | はい |
| イベント | SiGe: Materials, Processing, and Devices - Proceedings of the First Symposium - Honolulu, HI, 米国 継続期間: 10月 3 2004 → 10月 8 2004 |
その他
| その他 | SiGe: Materials, Processing, and Devices - Proceedings of the First Symposium |
|---|---|
| 国/地域 | 米国 |
| City | Honolulu, HI |
| Period | 10/3/04 → 10/8/04 |
!!!All Science Journal Classification (ASJC) codes
- 工学一般
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