TY - GEN
T1 - Fabrication of VGA size near-infrared image sensor using room-temperature flip-chip bonding technology
AU - Shuto, Takanori
AU - Iwanabe, Keiichiro
AU - Ogura, Mutsuo
AU - Nishida, Katsuhiko
AU - Asano, Tanemasa
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/1/30
Y1 - 2014/1/30
N2 - Room-temperature bonding technique using cone-shaped microbumps with the aid of ultrasonic vibration is applied to the fabrication of a near-infrared image sensor. The image sensor is fabricated using the flip-chip bonding of an InGaAs/InP photodiode-array chip and a Si CMOS readout IC chip. The pixel pitch is 15 μm to compose VGA class (640 × 512 pixels) resolution. High-quality imaging of a heated object and blood vessels of human hand is demonstrated.
AB - Room-temperature bonding technique using cone-shaped microbumps with the aid of ultrasonic vibration is applied to the fabrication of a near-infrared image sensor. The image sensor is fabricated using the flip-chip bonding of an InGaAs/InP photodiode-array chip and a Si CMOS readout IC chip. The pixel pitch is 15 μm to compose VGA class (640 × 512 pixels) resolution. High-quality imaging of a heated object and blood vessels of human hand is demonstrated.
UR - https://www.scopus.com/pages/publications/84946688747
UR - https://www.scopus.com/pages/publications/84946688747#tab=citedBy
U2 - 10.1109/EPTC.2014.7028408
DO - 10.1109/EPTC.2014.7028408
M3 - Conference contribution
AN - SCOPUS:84946688747
T3 - Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
SP - 536
EP - 539
BT - Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014
Y2 - 3 December 2014 through 5 December 2014
ER -