TY - GEN
T1 - Electrostatic inkjet patterning using Si needle prepared by anodization
AU - Ishida, Yuji
AU - Hakiai, Kazunori
AU - Matsuzaki, Kazunari
AU - Baba, Akiyoshi
AU - Asano, Tanemasa
PY - 2004
Y1 - 2004
N2 - Electrostatic inkjet pattern formation was carried out using Si-needle inkjet head. The head was fabricated by preparing the Si needle using anodization of Si(100) with pn-junction at the surface and transferring the needle to another Si substrate using direct bonding technique. The printed pattern was observed with an optical microscope. The line width decreased with increasing the scanning velocity. The fine patterning technology was expected to facilitate the application of the liquid ejection technology to various electronic devices.
AB - Electrostatic inkjet pattern formation was carried out using Si-needle inkjet head. The head was fabricated by preparing the Si needle using anodization of Si(100) with pn-junction at the surface and transferring the needle to another Si substrate using direct bonding technique. The printed pattern was observed with an optical microscope. The line width decreased with increasing the scanning velocity. The fine patterning technology was expected to facilitate the application of the liquid ejection technology to various electronic devices.
UR - https://www.scopus.com/pages/publications/23244455952
UR - https://www.scopus.com/pages/publications/23244455952#tab=citedBy
M3 - Conference contribution
AN - SCOPUS:23244455952
SN - 4990247205
T3 - Digest of Papers - Microprocesses and Nanotechnology 2004
SP - 28
EP - 29
BT - Digest of Papers - Microprocesses and Nanotechnology 2004
T2 - 2004 International Microprocesses and Nanotechnology Conference
Y2 - 26 October 2004 through 29 October 2004
ER -