Electrochemical processing of Cu and Ni nanowire arrays

Munekazu Motoyama, Yasuhiro Fukunaka, Tetsuo Sakka, Yukio H. Ogata, Shiomi Kikuchi

研究成果: ジャーナルへの寄稿学術誌査読

83 被引用数 (Scopus)

抄録

Cu and Ni nanowire arrays were fabricated by potentiostatic electrodeposition into track-etched polycarbonate (PC) membranes. The diameters of nano-sized cylindrical pores in PC membranes varied from 15 to 200 nm. The transient current variation was divided into four stages during the growth of Cu and Ni nanowires. The nanowires were observed with FE-SEM and TEM. The aspect ratio of nanowire reached from 50 to 400. The diameters of nanowires were not perfectly uniform along the length. A knurled type of morphology was observed on the surface of nanowire with 15 nm diameter. Such a morphological variation was not governed by the overpotential, but attributed to the original shape of nanopore wall in PC membranes track-etched with heavy ions.

本文言語英語
ページ(範囲)84-91
ページ数8
ジャーナルJournal of Electroanalytical Chemistry
584
2
DOI
出版ステータス出版済み - 10月 15 2005
外部発表はい

!!!All Science Journal Classification (ASJC) codes

  • 分析化学
  • 化学工学一般
  • 電気化学

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