TY - GEN
T1 - Electrochemical processing of Cu and Ni nanowire arrays
AU - Motoyama, Munekazu
AU - Fukunaka, Yasuhiro
AU - Sakka, Tetsuo
AU - Ogata, Yukio H.
AU - Kikuchi, Shiomi
N1 - Funding Information:
The author thank Dr. T. Kuzuya for taking a FE-SEM image. Part of this work was supported by financial aides from the 21st century COE program and the Ministry of Education, Science and Culture (Giant-in-Aid for Exploration Research No. 15360402), for which the authors are granted.
PY - 2006
Y1 - 2006
N2 - Cu and Ni nanowire arrays were fabricated by potentiostatic electrodeposition into polycarbonate (PC) track-etched membranes with nano-sized cylindrical pores. The pore diameters of the membranes were from 15 to 200 run. The transient current variation can be divided into four stages during the growth of Cu and Ni nanowires. The nanowires were observed with FE-SEM and TEM. The length was controlled by the thickness of membranes. The aspect ratio reached more than 50. However, the diameters of wires were not perfectly uniform along the length. In the case of nanowire with 15 nm diam, the knurled shape was observed on its side. Such morphology did not depend on the overpotential and the type of metal, Cu or Ni. It may be attributed to the original shape of the pore wall in PC membranes track-etched with heavy ion.
AB - Cu and Ni nanowire arrays were fabricated by potentiostatic electrodeposition into polycarbonate (PC) track-etched membranes with nano-sized cylindrical pores. The pore diameters of the membranes were from 15 to 200 run. The transient current variation can be divided into four stages during the growth of Cu and Ni nanowires. The nanowires were observed with FE-SEM and TEM. The length was controlled by the thickness of membranes. The aspect ratio reached more than 50. However, the diameters of wires were not perfectly uniform along the length. In the case of nanowire with 15 nm diam, the knurled shape was observed on its side. Such morphology did not depend on the overpotential and the type of metal, Cu or Ni. It may be attributed to the original shape of the pore wall in PC membranes track-etched with heavy ion.
UR - http://www.scopus.com/inward/record.url?scp=33745944714&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33745944714&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:33745944714
SN - 1566774748
SN - 9781566774741
T3 - Proceedings - Electrochemical Society
SP - 99
EP - 108
BT - Pits and Pores III
T2 - 206th Electrochemical Society Meeting
Y2 - 3 October 2004 through 8 October 2004
ER -