TY - JOUR
T1 - Electrochemical metal deposition on silicon
AU - Ogata, Yukio H.
AU - Kobayashi, Katsutoshi
AU - Motoyama, Munekazu
N1 - Funding Information:
The authors thank T. Sakka, K. Fukami, Y.L. Kawamura and T. Matsumoto for their discussion and help during the preparation of the manuscript, and acknowledge financial support by a grant-in-aid from the Japan Society for the Promotion of Science under Grant No. 18350107.
PY - 2006/6
Y1 - 2006/6
N2 - Electrochemical metal deposition is utilized to fabricate micro- and nano-structures. A variety of the structures have been achieved in metal patterning and structuring and also in the structure formation of silicon itself. The controlling factors and conditions of the size, morphology and distribution have been investigated. The importance of metal deposition by displacement reaction should be recognized.
AB - Electrochemical metal deposition is utilized to fabricate micro- and nano-structures. A variety of the structures have been achieved in metal patterning and structuring and also in the structure formation of silicon itself. The controlling factors and conditions of the size, morphology and distribution have been investigated. The importance of metal deposition by displacement reaction should be recognized.
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U2 - 10.1016/j.cossms.2007.02.001
DO - 10.1016/j.cossms.2007.02.001
M3 - Article
AN - SCOPUS:34249944669
SN - 1359-0286
VL - 10
SP - 163
EP - 172
JO - Current Opinion in Solid State and Materials Science
JF - Current Opinion in Solid State and Materials Science
IS - 3-4
ER -