TY - JOUR
T1 - Effects of carbon nanoparticle insertion on stress reduction in hydrogenated amorphous carbon films using plasma chemical vapor deposition
AU - Ono, Shinjiro
AU - Hwang, Sung Hwa
AU - Okumura, Takamasa
AU - Yamashita, Naoto
AU - Kamataki, Kunihiro
AU - Kiyama, Haruki
AU - Itagaki, Naho
AU - Koga, Kazunori
AU - Shiratani, Masaharu
N1 - Publisher Copyright:
© 2024 The Authors
PY - 2024/12
Y1 - 2024/12
N2 - Stress reduction in hydrogenated amorphous carbon (a-C:H) films is of considerable interest for improving their performance as protective films. Herein, we reduced the compressive stress of the films by inserting carbon nanoparticles (CNPs) between two a-C:H layers to form an a-C:H/CNP/a-C:H sandwich structure using a system of plasma chemical vapor deposition (CVD). We measured the deposition features of the CNPs via transmission electron microscopy (TEM) and assessed the dependence of the stress on the thickness of the second a-C:H layer as a parameter of surface coverage, Cp. We represented the stress reduction as a function of Cp; mean size of large CNPs, and thickness of the first and second a-C:H layers. In addition, the surface and film morphologies were investigated using atomic force microscopy (AFM) and cross-sectional scanning electron microscopy (SEM). Compared with films without CNPs, those containing CNPs with 8.9 % Cp showed 36 % lower stress when the thickness of the second a-C:H layer was similar to that of the first (154 nm). The deposited CNPs exhibited two size groups, with mean sizes of the small and large CNPs of 5 and 16 nm, respectively. Stress reduction was strongly correlated with the distance between large CNPs. The insertion of CNPs between a-C:H films affects the surface morphology of the second layer, and the stress decreases when the growth stage of the film starts transitioning from three-dimensional (3D) to two-dimensional (2D).
AB - Stress reduction in hydrogenated amorphous carbon (a-C:H) films is of considerable interest for improving their performance as protective films. Herein, we reduced the compressive stress of the films by inserting carbon nanoparticles (CNPs) between two a-C:H layers to form an a-C:H/CNP/a-C:H sandwich structure using a system of plasma chemical vapor deposition (CVD). We measured the deposition features of the CNPs via transmission electron microscopy (TEM) and assessed the dependence of the stress on the thickness of the second a-C:H layer as a parameter of surface coverage, Cp. We represented the stress reduction as a function of Cp; mean size of large CNPs, and thickness of the first and second a-C:H layers. In addition, the surface and film morphologies were investigated using atomic force microscopy (AFM) and cross-sectional scanning electron microscopy (SEM). Compared with films without CNPs, those containing CNPs with 8.9 % Cp showed 36 % lower stress when the thickness of the second a-C:H layer was similar to that of the first (154 nm). The deposited CNPs exhibited two size groups, with mean sizes of the small and large CNPs of 5 and 16 nm, respectively. Stress reduction was strongly correlated with the distance between large CNPs. The insertion of CNPs between a-C:H films affects the surface morphology of the second layer, and the stress decreases when the growth stage of the film starts transitioning from three-dimensional (3D) to two-dimensional (2D).
KW - Capacitively coupled plasma CVD
KW - Carbon nanoparticles
KW - Film stress
KW - Hydrogenated amorphous carbon
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U2 - 10.1016/j.diamond.2024.111654
DO - 10.1016/j.diamond.2024.111654
M3 - Article
AN - SCOPUS:85206520175
SN - 0925-9635
VL - 150
JO - Diamond and Related Materials
JF - Diamond and Related Materials
M1 - 111654
ER -