Effects of carbon nanoparticle insertion on stress reduction in hydrogenated amorphous carbon films using plasma chemical vapor deposition

研究成果: ジャーナルへの寄稿学術誌査読

1 被引用数 (Scopus)

抄録

Stress reduction in hydrogenated amorphous carbon (a-C:H) films is of considerable interest for improving their performance as protective films. Herein, we reduced the compressive stress of the films by inserting carbon nanoparticles (CNPs) between two a-C:H layers to form an a-C:H/CNP/a-C:H sandwich structure using a system of plasma chemical vapor deposition (CVD). We measured the deposition features of the CNPs via transmission electron microscopy (TEM) and assessed the dependence of the stress on the thickness of the second a-C:H layer as a parameter of surface coverage, Cp. We represented the stress reduction as a function of Cp; mean size of large CNPs, and thickness of the first and second a-C:H layers. In addition, the surface and film morphologies were investigated using atomic force microscopy (AFM) and cross-sectional scanning electron microscopy (SEM). Compared with films without CNPs, those containing CNPs with 8.9 % Cp showed 36 % lower stress when the thickness of the second a-C:H layer was similar to that of the first (154 nm). The deposited CNPs exhibited two size groups, with mean sizes of the small and large CNPs of 5 and 16 nm, respectively. Stress reduction was strongly correlated with the distance between large CNPs. The insertion of CNPs between a-C:H films affects the surface morphology of the second layer, and the stress decreases when the growth stage of the film starts transitioning from three-dimensional (3D) to two-dimensional (2D).

本文言語英語
論文番号111654
ジャーナルDiamond and Related Materials
150
DOI
出版ステータス出版済み - 12月 2024
外部発表はい

!!!All Science Journal Classification (ASJC) codes

  • 電子材料、光学材料、および磁性材料
  • 化学一般
  • 機械工学
  • 物理学および天文学一般
  • 材料化学
  • 電子工学および電気工学

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