Effect of Ni on phase stability and thermal expansion of Cu 6-xNi xSn 5 (X = 0, 0.5, 1, 1.5 and 2)

K. Nogita, D. Mu, S. D. McDonald, J. Read, Y. Q. Wu

研究成果: ジャーナルへの寄稿学術誌査読

65 被引用数 (Scopus)

抄録

The crystallography of the Cu 6Sn 5 intermetallic that forms at the solder-substrate interface in many soldering operations can be influenced by Ni additions. It has been established that when Ni is present at 5-9 at%, the high-temperature hexagonal Cu 6Sn 5 (η) does not transition to the low-temperature monoclinic Cu 6Sn 5 (η′) at the equilibrium temperature of 186°C. In fact, the hexagonal phase remains stable from room temperature to 250°C. This paper shows the stabilising effect of Ni exists in the range of 4.6-17.2 at% Ni in stoichiometric samples, over the larger temperature range of -100 to 250°C using synchrotron X-ray diffraction. The results are also used in combination with dilatometry experiments and show that Ni decreases the magnitude of thermal expansion, and prevents the discontinuity in expansion that occurs with the polymorphic transformation.

本文言語英語
ページ(範囲)78-85
ページ数8
ジャーナルIntermetallics
26
DOI
出版ステータス出版済み - 7月 2012
外部発表はい

!!!All Science Journal Classification (ASJC) codes

  • 化学一般
  • 材料力学
  • 機械工学
  • 金属および合金
  • 材料化学

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