Development of a wide-band compact diplexer using a redistribution layer for 5G application

Yuki Fujii; Hiroaki Nagano; Yuya Ishiguro; Teruo Horiguchi; Naoya Akita; Koichi Sakamoto; Haruichi Kanaya

doi:10.1109/EPTC53413.2021.9663916

Development of a wide-band compact diplexer using a redistribution layer for 5G application

Yuki Fujii
, Hiroaki Nagano
, Yuya Ishiguro
, Teruo Horiguchi
, Naoya Akita
, Koichi Sakamoto
, Haruichi Kanaya

集積電子システム

研究成果: 書籍/レポートタイプへの寄稿 › 会議への寄与

抄録

This paper presents a design of a wide-band compact diplexer using a redistribution layer (RDL) for 5G application. The proposed diplexer is combined a low pass filter (LPF) which has designed frequency at 4.1 GHz for n77 band and a high pass filter (HPF) which has designed frequency at 4.5 GHz. for n79 band. Moreover, spiral inductor is attached to enhance the band rejection characteristics. In the circuit simulation, input reflection coefficient (S11) is less than -10dB from 3.3 to 5.0 GHz. Insertion loss in low band (S21) is lower than -3dB ffom 3.3 to 4.1 GHz and that in high band (S31) is lower than -3dB from 4.5 to 5.0 GHz.

本文言語	英語
ホスト出版物のタイトル	2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	339-342
ページ数	4
ISBN（電子版）	9781665416191
DOI	https://doi.org/10.1109/EPTC53413.2021.9663916
出版ステータス	出版済み - 2021
イベント	23rd IEEE Electronics Packaging Technology Conference, EPTC 2021 - Virtual, Online, シンガポール継続期間: 12月 1 2021 → 12月 30 2021

出版物シリーズ

名前	2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021

会議

会議	23rd IEEE Electronics Packaging Technology Conference, EPTC 2021
国/地域	シンガポール
City	Virtual, Online
Period	12/1/21 → 12/30/21

!!!All Science Journal Classification (ASJC) codes

電子工学および電気工学
安全性、リスク、信頼性、品質管理
電子材料、光学材料、および磁性材料
流体および伝熱

文献へのアクセス

10.1109/EPTC53413.2021.9663916

他のファイルとリンク

引用スタイル

Fujii, Y., Nagano, H., Ishiguro, Y., Horiguchi, T., Akita, N., Sakamoto, K., & Kanaya, H. (2021). Development of a wide-band compact diplexer using a redistribution layer for 5G application. In 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021 (pp. 339-342). (2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC53413.2021.9663916

Development of a wide-band compact diplexer using a redistribution layer for 5G application. / Fujii, Yuki; Nagano, Hiroaki; Ishiguro, Yuya その他.
2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 339-342 (2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021).

研究成果: 書籍/レポートタイプへの寄稿 › 会議への寄与

Fujii, Y, Nagano, H, Ishiguro, Y, Horiguchi, T, Akita, N, Sakamoto, K & Kanaya, H 2021, Development of a wide-band compact diplexer using a redistribution layer for 5G application. in 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021. 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021, Institute of Electrical and Electronics Engineers Inc., pp. 339-342, 23rd IEEE Electronics Packaging Technology Conference, EPTC 2021, Virtual, Online, シンガポール, 12/1/21. https://doi.org/10.1109/EPTC53413.2021.9663916

Fujii Y, Nagano H, Ishiguro Y, Horiguchi T, Akita N, Sakamoto K その他. Development of a wide-band compact diplexer using a redistribution layer for 5G application. In 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021. Institute of Electrical and Electronics Engineers Inc. 2021. p. 339-342. (2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021). doi: 10.1109/EPTC53413.2021.9663916

Fujii, Yuki ; Nagano, Hiroaki ; Ishiguro, Yuya その他. / Development of a wide-band compact diplexer using a redistribution layer for 5G application. 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021. Institute of Electrical and Electronics Engineers Inc., 2021. pp. 339-342 (2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021).

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abstract = "This paper presents a design of a wide-band compact diplexer using a redistribution layer (RDL) for 5G application. The proposed diplexer is combined a low pass filter (LPF) which has designed frequency at 4.1 GHz for n77 band and a high pass filter (HPF) which has designed frequency at 4.5 GHz. for n79 band. Moreover, spiral inductor is attached to enhance the band rejection characteristics. In the circuit simulation, input reflection coefficient (S11) is less than -10dB from 3.3 to 5.0 GHz. Insertion loss in low band (S21) is lower than -3dB ffom 3.3 to 4.1 GHz and that in high band (S31) is lower than -3dB from 4.5 to 5.0 GHz.",

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AU - Akita, Naoya

AU - Sakamoto, Koichi

AU - Kanaya, Haruichi

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Development of a wide-band compact diplexer using a redistribution layer for 5G application

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出版物シリーズ

会議

!!!All Science Journal Classification (ASJC) codes

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