TY - GEN
T1 - Aging behavior of Cu-Ni-Si alloy processed by high-pressure torsion
AU - Matsunaga, Hirotaka
AU - Horita, Zenji
AU - Imamura, Kazutaka
AU - Kiss, Takanobu
AU - Sauvage, Xavier
PY - 2011/2/25
Y1 - 2011/2/25
N2 - An age-hardenable Cu-2.9%Ni-0.6%Si alloy was subjected to high-pressure torsion. Aging behavior was investigated in terms of hardness, electrical conductivity and microstructural features. Transmission electron microscopy showed that the grain size is refined to ∼150 nm and the Vickers microhardness was significantly increased through the HPT process. Aging treatment of the HPT-processed alloy led to a further increase in the hardness. Electrical conductivity is also improved with the aging treatment. It was confirmed that the simultaneous strengthening by grain refinement and fine precipitation is achieved while maintaining high electrical conductivity. Three dimensional atom probe analysis revealed that fine precipitates with sizes of ∼20 nm or smaller were formed in the Cu matrix and some particles consist of Ni and Si with no appreciable amount of Cu.
AB - An age-hardenable Cu-2.9%Ni-0.6%Si alloy was subjected to high-pressure torsion. Aging behavior was investigated in terms of hardness, electrical conductivity and microstructural features. Transmission electron microscopy showed that the grain size is refined to ∼150 nm and the Vickers microhardness was significantly increased through the HPT process. Aging treatment of the HPT-processed alloy led to a further increase in the hardness. Electrical conductivity is also improved with the aging treatment. It was confirmed that the simultaneous strengthening by grain refinement and fine precipitation is achieved while maintaining high electrical conductivity. Three dimensional atom probe analysis revealed that fine precipitates with sizes of ∼20 nm or smaller were formed in the Cu matrix and some particles consist of Ni and Si with no appreciable amount of Cu.
UR - http://www.scopus.com/inward/record.url?scp=79951820135&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79951820135&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.667-669.307
DO - 10.4028/www.scientific.net/MSF.667-669.307
M3 - Conference contribution
AN - SCOPUS:79951820135
SN - 9783037850077
T3 - Materials Science Forum
SP - 307
EP - 312
BT - Nanomaterials by Severe Plastic Deformation, NanoSPD5
T2 - 5th International Conference on Nanomaterials by Severe Plastic Deformation, NanoSPD5
Y2 - 21 March 2011 through 25 March 2011
ER -