抄録
The damage evolution in Bi2223 filaments and its influence on critical current was described by a Monte Carlo-shear lag simulation method. The experimentally observed zigzag crack propagation across aligned Bi2223 grains under tensile strain was effectively modelled by including transverse and longitudinal failure modes for individual grains. From the simulated stress-strain curve, the survival parameter (slope of the stress-strain curve normalized with respect to the original Young's modulus) was estimated with increasing applied strain. With this parameter combined with the strain sensitivity of the critical current, the measured change of critical current of the composite tape with applied strain could be described well.
本文言語 | 英語 |
---|---|
ページ(範囲) | S232-S240 |
ジャーナル | Superconductor Science and Technology |
巻 | 18 |
号 | 12 |
DOI | |
出版ステータス | 出版済み - 12月 1 2005 |
外部発表 | はい |
!!!All Science Journal Classification (ASJC) codes
- セラミックおよび複合材料
- 凝縮系物理学
- 金属および合金
- 電子工学および電気工学
- 材料化学