A Monte Carlo-shear lag simulation of tensile fracture behaviour of Bi2223 filament

S. Ochiai, T. Ishida, D. Doko, K. Morishita, H. Okuda, S. S. Oh, D. W. Ha, M. Hojo, M. Tanaka, M. Sugano, K. Osamura

研究成果: ジャーナルへの寄稿学術誌査読

21 被引用数 (Scopus)

抄録

The damage evolution in Bi2223 filaments and its influence on critical current was described by a Monte Carlo-shear lag simulation method. The experimentally observed zigzag crack propagation across aligned Bi2223 grains under tensile strain was effectively modelled by including transverse and longitudinal failure modes for individual grains. From the simulated stress-strain curve, the survival parameter (slope of the stress-strain curve normalized with respect to the original Young's modulus) was estimated with increasing applied strain. With this parameter combined with the strain sensitivity of the critical current, the measured change of critical current of the composite tape with applied strain could be described well.

本文言語英語
ページ(範囲)S232-S240
ジャーナルSuperconductor Science and Technology
18
12
DOI
出版ステータス出版済み - 12月 1 2005
外部発表はい

!!!All Science Journal Classification (ASJC) codes

  • セラミックおよび複合材料
  • 凝縮系物理学
  • 金属および合金
  • 電子工学および電気工学
  • 材料化学

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