TY - JOUR
T1 - A Future Outlook of Power Devices from the Viewpoint of Power Electronics Trends
AU - Saito, Wataru
N1 - Publisher Copyright:
© 1963-2012 IEEE.
PY - 2024/3/1
Y1 - 2024/3/1
N2 - A outlook for power devices is discussed from the perspectives of power device and power electronics application trends. The driving force of the power device business has changed from home appliances and industrial robots to electric vehicles (EV), and the most important trend has been the increase in power density in power modules by power loss reduction, high-temperature operation, and thermal resistance reduction. In the future, it can be expected that inverter-based resources and power supply integrated circuits (ICs) will be new driving forces for green transformation (GX) and digital transformation (DX). To continue the increasing power density trend of power modules, wide bandgap power devices are attractive. However, economic parameters, such as 'cost/power,' must be improved for wide installation in power grids with large volumes. In addition, it can be expected that hetero integration into power modules and GaN power ICs will be a new demand.
AB - A outlook for power devices is discussed from the perspectives of power device and power electronics application trends. The driving force of the power device business has changed from home appliances and industrial robots to electric vehicles (EV), and the most important trend has been the increase in power density in power modules by power loss reduction, high-temperature operation, and thermal resistance reduction. In the future, it can be expected that inverter-based resources and power supply integrated circuits (ICs) will be new driving forces for green transformation (GX) and digital transformation (DX). To continue the increasing power density trend of power modules, wide bandgap power devices are attractive. However, economic parameters, such as 'cost/power,' must be improved for wide installation in power grids with large volumes. In addition, it can be expected that hetero integration into power modules and GaN power ICs will be a new demand.
KW - Power devices
KW - power electronics
KW - power modules
UR - http://www.scopus.com/inward/record.url?scp=85177995823&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85177995823&partnerID=8YFLogxK
U2 - 10.1109/TED.2023.3332611
DO - 10.1109/TED.2023.3332611
M3 - Article
AN - SCOPUS:85177995823
SN - 0018-9383
VL - 71
SP - 1356
EP - 1364
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
IS - 3
ER -