A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods

Mohd Arif Anuar Mohd Salleh, Abdullah Mohd Mustafa Al Bakri, Flora Somidin, Andrei Vicor Sandu, Noraimza Saud, Hussin Kamaruddin, Stuart D. McDonald, Kazuhiro Nogita

研究成果: ジャーナルへの寄稿学術誌査読

9 被引用数 (Scopus)

抄録

The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting Sn-0.7Cu solder bulks. PM Sn-0.7Cu solder showed denser and finer Sn-grain structure, while cast Sn-0.7Cu showed larger Sn-rich dendrites with the presence of eutectic phase region. The mechanical performance of the solder bulk prepared with the PM technique was enhanced as it had higher microhardness value, UTS, and yield strength compared to the solder bulk prepared using the casting method. The solder wettability of the product was also increased using the PM method. Overall, the PM method can improve the mechanical and solderability properties of lead-free solder; therefore, it holds great potential as a new method for solder fabrication.

本文言語英語
ページ(範囲)725-728
ページ数4
ジャーナルRevista de Chimie
64
7
出版ステータス出版済み - 7月 2013
外部発表はい

!!!All Science Journal Classification (ASJC) codes

  • 化学一般
  • 材料科学(その他)
  • 工学一般
  • 表面、皮膜および薄膜
  • 材料化学

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