TY - GEN
T1 - 380V/1.9A GaN power-HEMT
T2 - IEEE International Electron Devices Meeting, 2005 IEDM
AU - Saito, Wataru
AU - Kuraguchi, Masahiko
AU - Takada, Yoshiharu
AU - Tsuda, Kunio
AU - Domon, Tomokazu
AU - Omura, Ichiro
AU - Yamaguchi, Masakazu
PY - 2005
Y1 - 2005
N2 - The current collapse phenomena in 380V/1.9A GaN power-HEMTs designed for high-voltage power electronics application is reported. The influence of these phenomena to the power-electronics circuit performance under high applied voltage is discussed using a 27.1 MHz class-E amplifier, which can be one of an industrial application candidate. It has been found that the optimized field plate structure minimizes the increase of conduction loss caused by the current collapse phenomena and thus improves the power efficiency of the circuit. The minimized device achieved the output power of 13.8 W and the power efficiency of 89.6 % for the demonstrated circuit even with the applied drain voltage of 330 V and the switching frequency of 27.1 MHz. These results show the future possibility of a new GaN-device application with both high voltage and high frequency condition.
AB - The current collapse phenomena in 380V/1.9A GaN power-HEMTs designed for high-voltage power electronics application is reported. The influence of these phenomena to the power-electronics circuit performance under high applied voltage is discussed using a 27.1 MHz class-E amplifier, which can be one of an industrial application candidate. It has been found that the optimized field plate structure minimizes the increase of conduction loss caused by the current collapse phenomena and thus improves the power efficiency of the circuit. The minimized device achieved the output power of 13.8 W and the power efficiency of 89.6 % for the demonstrated circuit even with the applied drain voltage of 330 V and the switching frequency of 27.1 MHz. These results show the future possibility of a new GaN-device application with both high voltage and high frequency condition.
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M3 - Conference contribution
AN - SCOPUS:33847715866
SN - 078039268X
SN - 9780780392687
T3 - Technical Digest - International Electron Devices Meeting, IEDM
SP - 586
EP - 589
BT - IEEE International Electron Devices Meeting, 2005 IEDM - Technical Digest
Y2 - 5 December 2005 through 7 December 2005
ER -