Ohno, Y., Yoshida, H., Kamiuchi, N.,
Aso, R., Takeda, S., Shimizu, Y., Ebisawa, N., Nagai, Y., Liang, J. & Shigekawa, N.,
5月 2019,
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc.,
1 p. 8735379. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).
研究成果: 書籍/レポート タイプへの寄稿 › 会議への寄与