XPS analysis of oxide films on lead-free solders with trace additions of Germanium and gallium

K. M. Watling, A. Chandler-Temple, K. Nogita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

A sessile drop experiment involving slow heating and cooling of lead-free solder alloys under inert gas revealed segregation of trace elements to the sample surface. Addition of germanium or gallium to Sn-0.7Cu-0.05Ni alloys promoted a metallic lustre in samples, in contrast with the blue/purple colour of the parent alloy. Alloys with Ge or Ga additions showed oxidation resistance. Depth profiling of surfaces of sample alloys with Ge or Ga showed a significant concentration of these elements within the oxide film, which may be responsible for oxidation resistance of these alloys.

Original languageEnglish
Title of host publicationAdvanced Materials Engineering and Technology IV
EditorsMohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Muhammad Faheem Mohd Tahir, Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Liyana Jamaludin
PublisherTrans Tech Publications Ltd
Pages63-67
Number of pages5
ISBN (Print)9783035710205
DOIs
Publication statusPublished - 2016
EventInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China
Duration: Dec 4 2015Dec 5 2015

Publication series

NameMaterials Science Forum
Volume857
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

OtherInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015
Country/TerritoryTaiwan, Province of China
CityKaohsiung
Period12/4/1512/5/15

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint

Dive into the research topics of 'XPS analysis of oxide films on lead-free solders with trace additions of Germanium and gallium'. Together they form a unique fingerprint.

Cite this