TY - GEN
T1 - Wireless micro energy harvesting circuit for sensor system
AU - Hatanaka, Shunsuke
AU - Kanaya, Haruichi
N1 - Funding Information:
This work was partly supported by VLSI Design and Education Center (VTEC), the University of Tokyo in collaboration with CADENCE Corporation and Keysight Technologies. This work was partly supported by a JSPS Grant-in-Aid for Collaborative Research Programs Based on Industrial Demand, KAKENHI and CREST, Japan.
Funding Information:
This work was also partially supported by the Grant-in-Aid for Scientific Research (18K04146) from the Japan Society for the Promotion of Science (JSPS), the Grant-in-Aid for the Collaborative Research Program Based on Industrial Demand, CREST (JPMJCR1431) JSPS, Grant-in-Aid for Collaborative Research Programs Based on Industrial Demand JST. This work was partially supported by the Cabinet Office (CAO), Cross-ministerial Strategic Innovation Promotion Program (SIP), “An intelligent knowledge processing infrastructure, integrating physical and virtual domains” (funding agency: NEDO).
Publisher Copyright:
© 2019 IEEE.
PY - 2019/12
Y1 - 2019/12
N2 - This paper presents the design of the wireless micro energy harvesting circuit for sensor network systems without any batteries. The circuit is composed of a series resonant circuit and RF-to-DC converting circuit. For multiband operation, bandpass filter theory is utilized. The simulation and measurement results are presented in this paper. The measurement output voltage is over 2.2 V at 920 MHz while input power is-4 dBm as a power source.
AB - This paper presents the design of the wireless micro energy harvesting circuit for sensor network systems without any batteries. The circuit is composed of a series resonant circuit and RF-to-DC converting circuit. For multiband operation, bandpass filter theory is utilized. The simulation and measurement results are presented in this paper. The measurement output voltage is over 2.2 V at 920 MHz while input power is-4 dBm as a power source.
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U2 - 10.1109/EPTC47984.2019.9026709
DO - 10.1109/EPTC47984.2019.9026709
M3 - Conference contribution
AN - SCOPUS:85082986175
T3 - 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019
SP - 116
EP - 119
BT - 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st IEEE Electronics Packaging Technology Conference, EPTC 2019
Y2 - 4 December 2019 through 6 December 2019
ER -