TY - JOUR
T1 - Wettability of Al2O3 by liquid Cu as influenced by additives and partial transient liquid-phase bonding of Al2O3
AU - Matsumoto, H.
AU - Locatelli, M. R.
AU - Nakashima, K.
AU - Glaeser, A. M.
AU - Mori, K.
N1 - Copyright:
Copyright 2017 Elsevier B.V., All rights reserved.
PY - 1995
Y1 - 1995
N2 - The effect of additions (Cr, Ni and 80Ni·20Cr alloy) on the wetting characteristics of liquid Cu on Al2O3 has been studied using a sessile drop method in a vacuum at 1150°C. Through the use of microdesigned multilayer Cu/80Ni·20Cr/Cu interlayers, PTLP (Partial Transient Liquid-Phase) bonding of Al2O3 has been achieved in a vacuum at 1150°C. These results demonstrate that the bonding temperature, the dissolution of Cr into liquid Cu film improved the wettability of liquid Cu film on Al2O3 and facilitate the formation of reliably strong joint PTLP bonded Al2O3 using Cu/80Ni·20Cr/Cu interlayer.
AB - The effect of additions (Cr, Ni and 80Ni·20Cr alloy) on the wetting characteristics of liquid Cu on Al2O3 has been studied using a sessile drop method in a vacuum at 1150°C. Through the use of microdesigned multilayer Cu/80Ni·20Cr/Cu interlayers, PTLP (Partial Transient Liquid-Phase) bonding of Al2O3 has been achieved in a vacuum at 1150°C. These results demonstrate that the bonding temperature, the dissolution of Cr into liquid Cu film improved the wettability of liquid Cu film on Al2O3 and facilitate the formation of reliably strong joint PTLP bonded Al2O3 using Cu/80Ni·20Cr/Cu interlayer.
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U2 - 10.2320/matertrans1989.36.555
DO - 10.2320/matertrans1989.36.555
M3 - Article
AN - SCOPUS:0029293957
SN - 0916-1821
VL - 36
SP - 555
EP - 564
JO - materials transactions, jim
JF - materials transactions, jim
IS - 4
ER -