Wettability and interfacial reaction between Si3N4 and Cu-based alloys

K. Nakashima, T. Makino, K. Mori, A. M. Glaeser

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    1 Citation (Scopus)


    The effect of additions on the wetting characteristics of liquid Cu on a Si3N4 substrate has been studied in parallel with the study of joining of Si3N4 using Cu/80Ni·20Cr/Cu interlayers. The addition of 80Ni·20Cr alloy and Cr reduced the contact angle of liquid Cu on a Si3N4 substrate. The contact angle reduction depended upon the Cr content of the sessile drop and anneal time. A multiphase reaction layer developed at the interface between the Cu-rich solidified droplet and Si3N4 when Cr or 80Ni·20Cr was added. The failure of Cu/80Ni·20Cr/Cu interlay er bonded Si3N4 occurred along the Si3N4/interlayer interface. At near the Si3N4/interlayer interface, a multiphase reaction layer has also developed. The strengths of bonded Si3N4 are strongly affected by the interfacial reaction products.

    Original languageEnglish
    Pages (from-to)287-292
    Number of pages6
    JournalKey Engineering Materials
    Publication statusPublished - Dec 1 1999

    All Science Journal Classification (ASJC) codes

    • Materials Science(all)
    • Mechanics of Materials
    • Mechanical Engineering


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