Fingerprint
Dive into the research topics of 'Wafer-level compliant bump for 3D chip-stacking'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Wafer-level compliant bump for 3D chip-stacking
Naoya Watanabe, Takeaki Kojima, Tanemasa Asano
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1
Citation
(Scopus)