Void growth by dislocation-loop emission

Experimental results from spall tests on aluminum reveal the presence of a dense dislocation structure in an annulus around a void that grew under the tensile pulse when a shock wave was reflected at the free surface of the specimen. The proposition is that dislocation emission from the void surface under load is a viable mechanism for void growth. To understand void growth in the absence of diffusive effects, the interstitial-loop emission mechanism under tensile hydrostatic stress is investigated. First, the micromechanics of pile-up formation when interstitial loops are emitted from a void under applied macroscopic loading is reviewed. Demand for surface energy expenditure upon void-surface change is taken into consideration. It is demonstrated that in face-centered cubic metals loop emission from voids with a radius of ∼10 nm is indeed energetically possible in the hydrostatic stress environment generated by shock loading. On the other hand, the levels of hydrostatic stress prevalent in common structural applications are not sufficient to drive loops at equilibrium positions above a ∼10nm void. However, for voids larger than about 100 nm, the energetics of loop emission are easily met as a necessary condition even under the low stress environment prevalent in structural applications.