Abstract
The high cycle vibration fatigue life characteristics of Pb-free and Pb packages were studied under various mixed mode stress by a new test method and FEM. It was found that the effect of frequency on a high cycles vibration fatigue life of Pb-free and Pb package can be ignored within a range of 10∼25Hz. Using a normal shear stress, the evaluation of Pb-free and Pb package fatigue life was possible without considering a mixed mode stress. The vibration fatigue induced a crack in a solder ball itself.
| Original language | English |
|---|---|
| Pages (from-to) | 891-897 |
| Number of pages | 7 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| Publication status | Published - Jul 17 2003 |
| Event | 53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States Duration: May 27 2003 → May 30 2003 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering