Verification of generation and removal process of surface brittle film, in polishing process using water soluble fullerenol

Engineering

• Water 100%
• Surfaces 66%
• Particle Size 66%
• Abrasive Grain 66%
• Planarization 33%
• Mechanisms 33%
• Large Amount 33%
• High Quality 33%
• Efficiency 33%
• Networks (Circuits) 33%
• Determines 33%
• Fabrication 33%
• High Density 33%
• Porous Film 33%
• Flatness 33%
• Surface Condition 33%
• Design Rule 33%
• Polishing Process 33%
• Removal Process 33%
• Multilayer Interconnection 33%
• Chemical Effect 33%

Physics

• Water 100%
• Copper 100%
• Particle Size 66%
• Fabrication 33%
• Wafer 33%
• Circuits 33%
• Semiconductor Device 33%
• Slurries 33%
• Flatness 33%

Material Science

• Liquid Films 100%
• Surface 66%
• Material 33%
• Slurry 33%