Uniformity of an electroless plated Ni on a pad connected to different size pads or a Pn junction for under bump metallurgy in a flip-chip assembly

Akihiro Ikeda, Tsubasa Saeki, Atsushi Sakamoto, Yosuke Sugimoto, Yasuhiro Kimiya, Fukunaga Fukunaga, Reiji Hattori, Hisao Kuriyaki, Yukinori Kuroki

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

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