Unidirectional solidification of Al-Cu alloy films between solid plates

Nobuyuki Mori, Takeshi Kitaoka, Hirofumi Miyahara, Keisaku Ogi

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    4 Citations (Scopus)


    To clarify the solidification mechanism of thin alloy films between solid plates, the effects of the film thickness and the growth conditions on the unidirectional solidification structures of Al-Cu alloys were studied. The primary arm spacings of the thin film specimens, whose thicknesses were less than or equal to the secondary arm spacings, were twice or three times larger than those of bulk Al-15%Cu specimens. This phenomena were interpreted through the quantitative estimation of the influence of solid plates on the solute diffusion process in the liquid near dendrite tips. Two diffusion models were proposed, and the calculated ratios (Dh/D1) of the primary arm spacing Dh of the film and D1 of the bulk specimen were: (1) Columnar diffusion layer model: (Dh/D1) = {(4π/3)/ (2h/D1)}1/2, (2) Hemispherical diffusion layer model: (Dh/D1) = {(1/(2h/D1)}1/3. The intermediate value of the above models showed good agreement with the experimental ratios (dh/d1) of the film dh and the bulk d1.

    Original languageEnglish
    Pages (from-to)863-869
    Number of pages7
    JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
    Issue number9
    Publication statusPublished - 1996

    All Science Journal Classification (ASJC) codes

    • Condensed Matter Physics
    • Mechanics of Materials
    • Metals and Alloys
    • Materials Chemistry


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