TY - JOUR
T1 - Ultrasonic bonding of cone bump for integration of large-scale integrated circuits in flexible electronics
AU - Shuto, Takanori
AU - Iwanabe, Keiichiro
AU - Noda, Kazuhiro
AU - Nakai, Seiya
AU - Asano, Tanemasa
PY - 2013/5
Y1 - 2013/5
N2 - This paper reports that room-temperature bonding of LSI chips to metalization on a plastic film made of poly(ethylene naphthalate) (PEN) can be realized by ultrasonic bonding of a cone-shaped microbump made of Au. A 20-m-pitch area array of cone-shaped Au microbumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on Al interconnection. Bonding of 8,800 bump connections with 83.4m/bump has been achieved at room temperature.
AB - This paper reports that room-temperature bonding of LSI chips to metalization on a plastic film made of poly(ethylene naphthalate) (PEN) can be realized by ultrasonic bonding of a cone-shaped microbump made of Au. A 20-m-pitch area array of cone-shaped Au microbumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on Al interconnection. Bonding of 8,800 bump connections with 83.4m/bump has been achieved at room temperature.
UR - http://www.scopus.com/inward/record.url?scp=84880862880&partnerID=8YFLogxK
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U2 - 10.7567/JJAP.52.05DB10
DO - 10.7567/JJAP.52.05DB10
M3 - Article
AN - SCOPUS:84880862880
SN - 0021-4922
VL - 52
JO - Japanese journal of applied physics
JF - Japanese journal of applied physics
IS - 5 PART 2
M1 - 05DB10
ER -