Trend in thermal resistance of advanced power modules

Nobuyuki Shishido, Masanori Tsukuda, Shin Ichi Nishizawa

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)

    Abstract

    Thermal management is essential to reliable design of power modules. In this report, a trend in the thermal resistance of power modules was examined by reviewing the current cooling technologies. The thermal resistance of power modules has decreased to approximately 1/3x in 10 years. Our numerical simulation about cooling suggests that a straightforward development in liquid cooling technology can achieve the update corresponds to the expected change in next 5 year when it keeps this trend in next decades. However, further progress in thermal resistance shall require higher thermal-conductive materials for spreader and two-phase cooling technologies.

    Original languageEnglish
    Title of host publicationPCIM Europe-International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2019
    EditorsMartina Amrhein, Anna Schulze Niehoff
    PublisherMesago PCIM GmbH
    Pages104-108
    Number of pages5
    ISBN (Print)9783800749386
    Publication statusPublished - 2019
    EventInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2019 - Nuremberg, Germany
    Duration: May 7 2019May 9 2019

    Publication series

    NamePCIM Europe Conference Proceedings
    ISSN (Electronic)2191-3358

    Conference

    ConferenceInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2019
    Country/TerritoryGermany
    CityNuremberg
    Period5/7/195/9/19

    All Science Journal Classification (ASJC) codes

    • Electrical and Electronic Engineering

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