Transmission electron microscopy study on microstructure of Ag-Based conductive adhesives

Naoyuki Kawamoto, Yasukazu Murakami, Daisuke Shindo, Yuichiro Hayasaka, Takeshi Kan, Katsuaki Suganuma

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


We used advanced electron microscopy techniques to study the microstructure of Ag-based conductive adhesives, which are promising alternatives to Pb-free solders. Systematic microscopy observations revealed the development of connections between Ag agglomerates, when the weight density of Ag (Ag content) was increased up to 92mass%. However, in a sample containing 94mass% Ag, disconnection between well-defined Ag agglomerates and/or formation of voids between Ag-filler particles were observed. These results appeared to be consistent with the plot of resistivity versus Ag content: the resistivity decreased to a minimum value at 92 mass% Ag. We also demonstrated the formation of very small Ag particles in a thin-foil specimen subjected to electrical breakdown. This microscopic observation may be useful for understanding the process of electric breakdown in thin-foil specimens.

Original languageEnglish
Pages (from-to)1773-1778
Number of pages6
JournalMaterials Transactions
Issue number10
Publication statusPublished - Oct 2010
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


Dive into the research topics of 'Transmission electron microscopy study on microstructure of Ag-Based conductive adhesives'. Together they form a unique fingerprint.

Cite this