TY - GEN
T1 - Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair
AU - Chakraborty, Anutosh
AU - Saha, Bidyut Baran
AU - Ng, Kim Choon
AU - He, Jingming
AU - El-Sharkawy, Ibrahim Ibrahim
AU - Koyama, Shigeru
PY - 2009
Y1 - 2009
N2 - This article presents the transient analysis of an advanced adsorption cooling device utilizing copper sputtered silica-gel as adsorbent and water as adsorbate, which is based on the experimentally confirmed adsorption isotherms and kinetics data so that an innovative and interesting solid sorption cooler can be developed for micro-electronics cooling purposes. In this paper, we also furnish the adsorption isotherms and kinetics data of copper sputtered silica-gel and water systems. A detailed transient computer simulation has been conducted to calculate its performances in terms of cooling capacity for various heat source temperatures and a constant heat sink temperature of 30 °C. It is found that the proposed innovative cooling cycle yields a cooling capacity up to 20 Watt per cm2, and is operated effectively by low-grade waste heat sources of temperature as low as 60 °C. Another noteworthy finding is that, the load surface temperature is able to achieve 20 °C for the cooling capacity of 10 Watt/cm2.
AB - This article presents the transient analysis of an advanced adsorption cooling device utilizing copper sputtered silica-gel as adsorbent and water as adsorbate, which is based on the experimentally confirmed adsorption isotherms and kinetics data so that an innovative and interesting solid sorption cooler can be developed for micro-electronics cooling purposes. In this paper, we also furnish the adsorption isotherms and kinetics data of copper sputtered silica-gel and water systems. A detailed transient computer simulation has been conducted to calculate its performances in terms of cooling capacity for various heat source temperatures and a constant heat sink temperature of 30 °C. It is found that the proposed innovative cooling cycle yields a cooling capacity up to 20 Watt per cm2, and is operated effectively by low-grade waste heat sources of temperature as low as 60 °C. Another noteworthy finding is that, the load surface temperature is able to achieve 20 °C for the cooling capacity of 10 Watt/cm2.
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M3 - Conference contribution
AN - SCOPUS:84907389011
SN - 9868509610
SN - 9789868509610
T3 - 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009
SP - 293
EP - 298
BT - 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009
PB - National Taipei University of Technology
T2 - 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009
Y2 - 20 May 2009 through 22 May 2009
ER -