TY - GEN
T1 - Tin whisker formation on a lead-free solder alloy studied by transmission electron microscopy
AU - Sosiati, H.
AU - Kuwano, N.
AU - Hata, S.
AU - Iwane, Y.
AU - Morizono, Y.
AU - Ohno, Y.
PY - 2006
Y1 - 2006
N2 - Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report characterization of microstructures in the whiskers grown on a surface of Sn/Cu-plated PI-flexible substrate by cross-sectional transmission electron microscopy (TEM) to analyze the behavior and the formation mechanism of whiskers. The whisker was found to be monocrystalline β-Sn and grown with the preferred directions of [110] and [101]. The whiskers formed on this tin surface are nucleated and grown by the compressive stress, that is induced externally by insertion of Sn/Cu-plated PI-flexible substrate into the connector.
AB - Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report characterization of microstructures in the whiskers grown on a surface of Sn/Cu-plated PI-flexible substrate by cross-sectional transmission electron microscopy (TEM) to analyze the behavior and the formation mechanism of whiskers. The whisker was found to be monocrystalline β-Sn and grown with the preferred directions of [110] and [101]. The whiskers formed on this tin surface are nucleated and grown by the compressive stress, that is induced externally by insertion of Sn/Cu-plated PI-flexible substrate into the connector.
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U2 - 10.1109/EPTC.2006.342749
DO - 10.1109/EPTC.2006.342749
M3 - Conference contribution
AN - SCOPUS:50249109631
SN - 142440665X
SN - 9781424406654
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
SP - 398
EP - 403
BT - 2006 8th Electronics Packaging Technology Conference, EPTC
T2 - 2006 8th Electronics Packaging Technology Conference, EPTC
Y2 - 6 December 2006 through 8 December 2006
ER -