Thermal model for hand-object interactions

Hsin Ni Ho, Lynette A. Jones

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)


A thermal model is proposed that predicts the temperature responses of the skin and material surface during hand-object interactions as well as the heat flux exchanged when the fingerpad makes contact with an object. The surface features of the fingerpad were measured in order to estimate the thermal contact resistance which is included in the model. A simulation based on the model was performed to calculate the thermal responses of the fingerpad as it made contact with a range of materials with varying thermal properties. A thermal measurement system based on an infrared camera has been designed and fabricated to overcome the limitations imposed by the contact thermal sensors. This system will be used to evaluate the validity of the model in predicting the changes in skin temperature during contact.

Original languageEnglish
Title of host publicationIEEE Virtual Reality, Haptics Symposium and Symposium on 3D User Interface, 2006
Number of pages1
Publication statusPublished - 2006
Externally publishedYes
EventIEEE Virtual Reality 2006 - Alexandria, VA, United States
Duration: Mar 25 2006Mar 29 2006

Publication series

NameProceedings - IEEE Virtual Reality


OtherIEEE Virtual Reality 2006
Country/TerritoryUnited States
CityAlexandria, VA

All Science Journal Classification (ASJC) codes

  • General Engineering


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